PCB Flow Chart.pdf
Rigid PCB Technical Capability:
| Items |
Technical Capability |
| Layers |
1-28 layers |
Min. line width/space |
4mil |
|
Max.board size (single&doule
sided)
|
600*1200mm |
Min.annular ring width: vias |
3mil |
| Surface finish |
HAL lead free,gold flash
Immersion silver,Immersion gold ,Immersion Sn,
hard gold,OSP,ect
|
Min.board thickness(multilayer) |
4layers:0.4mm;
6layers:0.6mm;
8layers:1.0mm;
10layers:1.20mm
|
| Board materials |
FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic,
PTFE,nelcon,
ISOLA,polyclad 370 HR); heavy copper,
Metal base clade laminate
|
Plating thickness (Technique:
Immersion Ni/Au)
|
Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U'' |
| Impedance control |
± 10% |
Distance between
line to board edge
|
Outline: 0.2mm
V-CUT: 0.4mm
|
|
Base copper thickness(Inner
and outer layer)
|
Min. thickness: 0.5 OZ Max.thickness: 6OZ |
Min.hole size(board thickness ≥2mm) |
Aspect ratio≤16 |
| Finished copper thickness |
Outer layers:
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness :0.5OZ,
Max.thickness : 6 OZ
|
Max.board thickness(single&doule sided) |
3.20mm |
Products Application:
1, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;
2, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;
3, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;
4, Industrial controls: Medical device ,UPS equipment, Control device etc;
5, Vehicle Electronices: Car etc;
6, Military & Defense : Military Weapons etc;
FAQ:
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. How many types of surface finish ACCPCB can do?
the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
5. What are the main factors which will affect the price of PCB?
Material;
Surface finish;
Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;
6. How to you make the impedance calculation?
The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.
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