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FR4 Rapid PCB Prototype PCB Board Green Solder Mask for 5G mobile equipment

FR4 Rapid PCB Prototype PCB Board Green Solder Mask for 5G mobile equipment

    • FR4 Rapid PCB Prototype PCB Board Green Solder Mask for 5G mobile equipment
    • FR4 Rapid PCB Prototype PCB Board Green Solder Mask for 5G mobile equipment
  • FR4 Rapid PCB Prototype PCB Board Green Solder Mask for 5G mobile equipment

    Product Details:

    Place of Origin: China
    Brand Name: ACCPCB
    Certification: ISO,SGS,TS16949
    Model Number: P1048

    Payment & Shipping Terms:

    Minimum Order Quantity: 1 PCS
    Price: Negotiable
    Packaging Details: Vacuum packing
    Delivery Time: 3-5days
    Payment Terms: T/T ,Western Union,Paypal
    Supply Ability: 50000SQ.M/Per Month
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    Detailed Product Description
    Material: FR4 Count: Multi Layer
    Surface Finish: HAL Lead Free Usage: Smart Home Equipment
    Solder Mask: Matte Green Copper Thickness: Standard 35um
    Board Thickness: 1.6mm-3.2mm Min. Line Spacing: 0.1mm4mil)
    Min. Line Width: 4mil Product Name: Printed Circuit Board,94v0 Pcb Board
    High Light:

    prototype circuit board

    ,

    electronic prototype board

    FR4 Rapid PCB Prototype PCB Board Green Solder Mask for 5G mobile equipment

     

    Production description :

     

    this board is a mulity layer pcb. it is used for 5G mobile equipment. we can accep PCB prototype,samll volum, middle and large volume. no MOQ request for new boards, for repeat order, just meet 3sq.m.

     

    Key Specifications/Special Features:

     

    Number of layers:

    Mulity Layer / 2-12 layer

    Base material:

    FR4

    Copper thickness: 1 oz Cu in all layer
    Board Thickness: 1.62 mm
    Size:

    200.6 x 196.5 mm

    Cooper In holes: min 20um
    Surface finishing:

    lead free HAL

    Solder mask:

    Green

    Legends:

    White

    Outline profile: Routing,V-Groove, Beveling punch
    Working panel size : max:1200mmX600mm (47'' X24'')
    Outline profile: Punching, Routing , CNC routing + V-cut
    Solder mask : LPI Solder mask, Peelable mask
    Twist and Bow : no more than 0.75 %
    Certificate : UL, CQC, TS16949, ISO14000, ROHS


     

    PCB Flow Chart.pdf

     

     

    Products Application:

     

    1, Telecom Communication
    2, Consumer Electronics
    3, Security monitor
    4, Vehicle Electronices
    5, Smart Home
    6, Industrial controls
    7, Military & Defense

     

    Rigid PCB Technical Capability:

     

    Items Technical Capability
    Layers 1-28 layers Min. line width/space 4mil

    Max.board size (single&doule

    sided)

    600*1200mm Min.annular ring width: vias 3mil
    Surface finish

    HAL lead free,gold flash

    Immersion silver,Immersion gold ,Immersion Sn,

    hard gold,OSP,ect

    Min.board thickness(multilayer) 4layers:0.4mm;
    6layers:0.6mm;
    8layers:1.0mm;
    10layers:1.20mm
    Board materials

    FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic,

    PTFE,nelcon,

    ISOLA,polyclad 370 HR); heavy copper,

    Metal base clade laminate

    Plating thickness (Technique:

    Immersion Ni/Au)

    Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''
    Impedance control ± 10%

    Distance between

    line to board edge

    Outline: 0.2mm

    V-CUT: 0.4mm

    Base copper thickness(Inner

    and outer layer)

    Min. thickness: 0.5 OZ Max.thickness: 6OZ Min.hole size(board thickness ≥2mm) Aspect ratio≤16
    Finished copper thickness Outer layers:
    Min.thickness 1 OZ,
    Max.thickness 10 OZ
    Inner layers:
    Min.thickness :0.5OZ,
    Max.thickness : 6 OZ
    Max.board thickness(single&doule sided) 3.20mm

     

     

    • FR4 Rapid PCB Prototype PCB Board Green Solder Mask for 5G mobile equipment 0

     

    FAQ

     

    1. How do ACCPCB ensure quality?

     

    Our high quality standard is achieved with the following.

    1.1 The process is strictly controlled under ISO 9001:2008 standards.
    1.2 Extensive use of software in managing the production process
    1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
    1.4.Dedicated quality assurance team with failure case analysis process

    2. What kinds of boards can ACCPCB process?

     

    Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


    3. What data are needed for PCB production?

     

    PCB Gerber files with RS-274-X format.


    4. What’s the typical process flow for multi-layer PCB?

     

    Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


    5. How many types of surface finish ACCPCB can do?

     

    O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


    6. What are the main factors which will affect the price of PCB?

     

    Material;
    Surface finish;

    Board thickness, Copper thickness;
    Technology difficulty;
    Different quality criteria;
    PCB characteristics;
    Payment terms;

     

    7. How to you make the impedance calculation?

     

    The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.

     

     

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    Contact Details
    Accuracy Electronics Technologies Co.,Ltd

    Contact Person: sales

    Send your inquiry directly to us (0 / 3000)