Name: Industrial Custom Prototype PCB with immersion gold for industrial control
Brand: ACCPCB
SKU: S1068

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Industrial Custom Prototype PCB with immersion gold for industrial control

Product Details:

Place of Origin:	China
Brand Name:	ACCPCB
Certification:	ISO,SGS,TS16949
Model Number:	S1068

Payment & Shipping Terms:

Minimum Order Quantity:	1 PCS
Price:	Negotiable
Packaging Details:	Vacuum packing
Delivery Time:	3-5days
Payment Terms:	T/T ,Western Union,Paypal
Supply Ability:	50000SQ.M/Per Month

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Detailed Product Description

Material:	FR4	Count:	Multi Layer / 6 Layer
Surface Finish:	ENIG	Usage:	Industrial Control
Solder Mask:	Green	Copper Thickness:	Standard
High Light:	quick turn pcb , electronic prototype board

Industrial Custom Prototype PCB Board with immersion gold for industrial control

Production description :

this board is 6layer pcb. it is used for industrial control. we can accep PCB prototype,samll volum, middle and large volume. no MOQ request for new boards, for repeat order, just meet 3sq.m.

Key Specifications/Special Features:

Number of layers:	Mulity Layer / 6 layer
Base material:	FR4tg150
Copper thickness:	1.5 / 1.5 /1.5 / 1.5 / 1.5 / 1.5 oz Cu
Thickness:	1.62 mm
Size:	260.6 x 180.5 mm
Cooper In holes:	min 20um
Surface finishing:	ENIG
Solder mask:	LPI
Solder mask:	Green
Legends:	White

PCB Flow Chart.pdf

Products Application:

1, Telecom Communication
2, Consumer Electronics
3, Security monitor
4, Vehicle Electronices
5, Smart Home
6, Industrial controls
7, Military & Defense

Rigid PCB Technical Capability:

Items	Technical Capability
Layers	1-28 layers	Min. line width/space	4mil
Max.board size (single&doule sided)	600*1200mm	Min.annular ring width: vias	3mil
Surface finish	HAL lead free,gold flash Immersion silver,Immersion gold ,Immersion Sn, hard gold,OSP,ect	Min.board thickness(multilayer)	4layers:0.4mm; 6layers:0.6mm; 8layers:1.0mm; 10layers:1.20mm
Board materials	FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic, PTFE,nelcon, ISOLA,polyclad 370 HR); heavy copper, Metal base clade laminate	Plating thickness (Technique: Immersion Ni/Au)	Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''
Impedance control	± 10%	Distance between line to board edge	Outline: 0.2mm V-CUT: 0.4mm
Base copper thickness(Inner and outer layer)	Min. thickness: 0.5 OZ Max.thickness: 6OZ	Min.hole size(board thickness ≥2mm)	Aspect ratio≤16
Finished copper thickness	Outer layers: Min.thickness 1 OZ, Max.thickness 10 OZ Inner layers: Min.thickness :0.5OZ, Max.thickness : 6 OZ	Max.board thickness(single&doule sided)	3.20mm

Advantages:
• Strict product liability, taking IPC-A-610 standard
• Engineering pretreatment before production
• Production process control (5Ms)
• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 100% AOI inspection, including X-ray, 3D microscope and ICT
• High-voltage test, impedance control test
• Micro section, soldering capacity, thermal stress test, shocking test
• In-house PCB production
• No minimum order quantity and free sample
• Focus on low to medium volume production
• Quick and on-time delivery

FAQ:
1. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

2. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.

3. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

4. How many types of surface finish ACCPCB can do?

the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.