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Inverter AC Lead Free HAL Prototype PCB Board Fr4 1OZ Copper Thickness

Inverter AC Lead Free HAL Prototype PCB Board Fr4 1OZ Copper Thickness

Inverter AC Lead Free HAL Prototype PCB Board Fr4 1OZ Copper Thickness
Inverter AC Lead Free HAL Prototype PCB Board Fr4 1OZ Copper Thickness
Inverter AC Lead Free HAL Prototype PCB Board Fr4 1OZ Copper Thickness
Product Details:
Place of Origin: China
Brand Name: ACCPCB
Certification: ISO,SGS,TS16949
Model Number: P1055
Payment & Shipping Terms:
Minimum Order Quantity: 1 PCS
Price: Negotiable
Packaging Details: Vacuum packing
Delivery Time: 3-5days
Payment Terms: T/T ,Western Union,Paypal
Supply Ability: 50000SQ.M/Per Month
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Detailed Product Description
Material: FR41g150 Count: Multi Layer / 2 Layer
Surface Finish: Immersion Gold Usage: Votage Regulator
Solder Mask: Green Copper Thickness: 1oz All Layer
Board Thickness: 0.3~2.5mm Min. Line Spacing: 0.1mm4mil)
Min. Line Width: 4mil Service: Customize
Item: Pcb
High Light:

quick turn pcb

,

prototype circuit board

Inverter AC Lead Free HAL Prototype PCB Board Fr4 1OZ Copper Thickness

 

Production description :

this board is 2 layer it is used on Inverter AC. we can accept PCB prototype,samll volum, middle and large volume. no MOQ request for new order.all of our PCB are met UL, TS 16949,ROHS, ISO etc. certification.

 

Key Specifications/Special Features:

Number of layers: Mulity Layer / 2 layer
Base material: FR4
Copper thickness: 1.5 / 1.5 oz Cu in all layer
Thickness:

1.50 mm

Size:

120.6 x 130.5 mm

Cooper In holes:

min 20um

Surface finishing: Immersion gold
Solder mask:

LPI

Solder mask:

Green

Working panel size : max:1200mmX600mm (47'' X24'')
Outline profile: Punching, Routing , CNC routing + V-cut
Solder Mask Color : Blue, Black,white, green
Certificate : UL, CQC, TS16949, ISO14000, ROHS
Twist and Bow : no more than 0.75 %

 

PCB Flow Chart.pdf

 

Products Application:

1, Telecom Communication
2, Consumer Electronics
3, Security monitor
4, Vehicle Electronices
5, Smart Home
6, Industrial controls
7, Military & Defense

 

Rigid PCB Technical Capability:

Items Technical Capability
Layers 1-28 layers Min. line width/space 4mil

Max.board size (single&doule

sided)

600*1200mm Min.annular ring width: vias 3mil
Surface finish

HAL lead free,gold flash

Immersion silver,Immersion gold ,Immersion Sn,

hard gold,OSP,ect

Min.board thickness(multilayer) 4layers:0.4mm;
6layers:0.6mm;
8layers:1.0mm;
10layers:1.20mm
Board materials

FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic,

PTFE,nelcon,

ISOLA,polyclad 370 HR); heavy copper,

Metal base clade laminate

Plating thickness (Technique:

Immersion Ni/Au)

Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''
Impedance control ± 10%

Distance between

line to board edge

Outline: 0.2mm

V-CUT: 0.4mm

Base copper thickness(Inner

and outer layer)

Min. thickness: 0.5 OZ Max.thickness: 6OZ Min.hole size(board thickness ≥2mm) Aspect ratio≤16
Finished copper thickness Outer layers:
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness :0.5OZ,
Max.thickness : 6 OZ
Max.board thickness(single&doule sided) 3.20mm

 

 

 

  • Inverter AC Lead Free HAL Prototype PCB Board Fr4 1OZ Copper Thickness 0

 

FAQ:

1. How do ACCPCB ensure quality?

   Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

   Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

   PCB Gerber files with RS-274-X format.


4. What’s the typical process flow for multi-layer PCB?

   Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


5. How many types of surface finish ACCPCB can do?

   the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

 

 

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Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Tel: +8615889494185

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