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KB FR4 Prototype PCB Fabrication Carbon Ink Lead Free HAL Surface Finishing

KB FR4 Prototype PCB Fabrication Carbon Ink Lead Free HAL Surface Finishing

    • KB FR4 Prototype PCB Fabrication Carbon Ink Lead Free HAL Surface Finishing
    • KB FR4 Prototype PCB Fabrication Carbon Ink Lead Free HAL Surface Finishing
  • KB FR4 Prototype PCB Fabrication Carbon Ink Lead Free HAL Surface Finishing

    Product Details:

    Place of Origin: China
    Brand Name: ACCPCB
    Certification: ISO,SGS,TS16949
    Model Number: S1021

    Payment & Shipping Terms:

    Minimum Order Quantity: 1 PCS
    Price: Negotiable
    Packaging Details: Vacuum packing
    Delivery Time: 3-5days
    Payment Terms: T/T ,Western Union,Paypal
    Supply Ability: 50000SQ.M/Per Month
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    Detailed Product Description
    Material: KB FR4 Count: Four Layer
    Surface Finish: Carbon+HAL LEAD FREE Usage: Consumer Electronics
    Solder Mask: Green Copper Thickness: 1oz All Layer
    Min. Line Spacing: 0.15mm Product Name: 94v0 Pcb Board
    Silkscreen Color: White Or On Your Request. Type: Customizable
    High Light:

    quick turn pcb

    ,

    prototype circuit board

    KB FR4 Prototype PCB Fabrication with Carbon ink + Lead free HAL surface finishing

     

    PCB Flow Chart.pdf

     

    Key Specifications/Special Features of carbon boards:

     

    Number of layers:  6 layer
    Base material:

    KB FR4

    Copper thickness: 1.0 oz Cu in all layer
    Thickness: 2.0 mm
    Size:

    150.6 x 100.5 mm

    Cooper In holes:

    min 20um

    Surface finishing:

    Carbon ink + HAL lead free

    Solder mask:

    LPI soldr mask. peelable mask

    Solder mask:

    Green

    Copper thickness in holes: 0.02mm-0.035mm
    min. line width/space: 0.10mm / 0.10mm
    min.solder mask window : 0.05mm
    outline profile: punching, routing,
    outline tolerance: +/-0.10mm
    twist and bow: no more than 0.75%
    Certificate : UL, CQC, TS16949, ISO14000, ROHS
    Aspect Ratio: 10:1(max)
    min. annular ring witdth: 0.05mm

     

    Advantages:


    • Strict product liability, taking IPC-A-160 standard
    • Engineering pretreatment before production
    • Production process control (5Ms)
    • 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
    • 100% AOI inspection, including X-ray, 3D microscope and ICT
    • High-voltage test, impedance control test
    • Micro section, soldering capacity, thermal stress test, shocking test
    • In-house PCB production
    • No minimum order quantity and free sample
    • Focus on low to medium volume production
    • Quick and on-time delivery

     

     

    KB FR4 Prototype PCB Fabrication Carbon Ink Lead Free HAL Surface Finishing 0

    FAQ :

     

    1. How do ACCPCB ensure quality?

     

    Our high quality standard is achieved with the following.

    1.1 The process is strictly controlled under ISO 9001:2008 standards.
    1.2 Extensive use of software in managing the production process
    1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
    1.4.Dedicated quality assurance team with failure case analysis process

    2. What kinds of boards can ACCPCB process?

     

    Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


    3. What data are needed for PCB production?

     

    PCB Gerber files with RS-274-X format.


    4. What’s the typical process flow for multi-layer PCB?

     

    Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


    5. How many types of surface finish ACCPCB can do?

     

    O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


    6. What are the main factors which will affect the price of PCB?

     

    Material;
    Surface finish;

    Board thickness, Copper thickness;
    Technology difficulty;
    Different quality criteria;
    PCB characteristics;
    Payment terms;

     

    7. How to you make the impedance calculation?

     

    The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.

     

             

    Contact Details
    Accuracy Electronics Technologies Co.,Ltd

    Contact Person: sales

    Send your inquiry directly to us (0 / 3000)