PCB Flow Chart.pdf
Rigid PCB Technical Capability:
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Items
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Technical Capability
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|
Layers
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1-28 layers
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Min. line width/space
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4mil
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Max.board size (single&doule
sided)
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600*1200mm
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Min.annular ring width: vias
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3mil
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Surface finish
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HAL lead free,gold flash
Immersion silver,Immersion gold ,Immersion Sn,
hard gold,OSP,ect
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Min.board thickness(multilayer)
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4layers:0.4mm;
6layers:0.6mm;
8layers:1.0mm;
10layers:1.20mm
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Board materials
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FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic,
PTFE,nelcon,
ISOLA,polyclad 370 HR); heavy copper,
Metal base clade laminate
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Plating thickness (Technique:
Immersion Ni/Au)
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Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''
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Impedance control
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± 10%
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Distance between
line to board edge
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Outline: 0.2mm
V-CUT: 0.4mm
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Base copper thickness(Inner
and outer layer)
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Min. thickness: 0.5 OZ Max.thickness: 6OZ
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Min.hole size(board thickness ≥2mm)
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Aspect ratio≤16
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Finished copper thickness
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Outer layers:
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness :0.5OZ,
Max.thickness : 6 OZ
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Max.board thickness(single&doule sided)
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3.20mm
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Products Application:
1, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;
2, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;
3, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;
4, Industrial controls: Medical device ,UPS equipment, Control device etc;
5, Vehicle Electronices: Car etc;
6, Military & Defense : Military Weapons etc;
FAQ:
1. How do ACCPCB ensure quality?
Our high quality standard is achieved with the following.
1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process
2. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
3. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
4. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
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