1 Oz HAL Lead Free PCB 4 Layer 1.35mm Thickness KB FR4 Material

1 Oz HAL Lead Free PCB 4 Layer 1.35mm Thickness KB FR4 Material

Production description :

this board is 4layer with HAL Lead free.  all PCB has passed UL, CE, ROSH ect certification. we can accept PCB prototype,samll volum, middle and large volume. no MOQ request for new boards.

PCB Flow Chart.pdf

Key Specifications of amplifier PCB board:

Products Application:

Our products are widely used in meter, medical, solar energy, mobile, communication, industrial control, power electronics,security, consuming, computer, automotive, aerospace, military and so on.

Technical Capability:

FAQ:

1. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

2. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.

3. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

4. How many types of surface finish ACCPCB can do?

O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

5. What are the main factors which will affect the price of PCB?

Material;
Surface finish;

Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;