Home ProductsLead Free PCB

8Lyaer Immersion Tin Lead Free PCB Electronic Board Assembly 1.0mm Board Thickness

8Lyaer Immersion Tin Lead Free PCB Electronic Board Assembly 1.0mm Board Thickness

8Lyaer Immersion Tin Lead Free PCB Electronic Board Assembly 1.0mm Board Thickness
8Lyaer Immersion Tin Lead Free PCB Electronic Board Assembly 1.0mm Board Thickness

Product Details:

Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: S1014

Payment & Shipping Terms:

Minimum Order Quantity: 1PCS
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 10days
Payment Terms: L/C / D/P / T/T / Western Union / Paypal
Supply Ability: 30,000SQ.M/Month
Contact Now
Detailed Product Description
Material: FR4 Tg130 Thickness: 1.250mm
Surface Finish: Immersion Tin Size: 120mmX120mm
Color: Black Solder Mask Min. Hole Size: 0.15MM
Copper Thickness: 35um Min. Line Width: 0.1 0mm
Min. Line Spacing: 0.1mm4mil) Service: OEM Services Provided
High Light:

enig rohs pcb

,

halogen free pcb

8Lyaer Immersion Tin Lead Free PCB Electronic Board Assembly 1.0mm Board Thickness

 

Production description :

 

this board is 8 layer PCB it is used on router device. PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new boards.

 

Production Feature:

 

Layer : 8Layers
Base Material : KB FR4
Copper Thickness : 1/1/1/1/1/1/1/1oz
Board Thickness : 1.250 mm
Surface Finish : Immersion Tin
Min. Hole Size : 6 mil / 0.15mm
Min. Line Width : 4/4 mil, 0.10/0.10 mm
Min. Line Spacing : 4/4mil, 0.10/0.10mm
Application : Router device
Certification : ISO9001, UL, ROHS,TS16949

 

PCB Flow Chart.pdf

 

 

Rigid PCB Technical Capability:

 

Items Technical Capability
Layers 1-28 layers Min. line width/space 4mil

Max.board size (single&doule

sided)

600*1200mm Min.annular ring width: vias 3mil
Surface finish

HAL lead free,gold flash

Immersion silver,Immersion gold ,Immersion Sn,

hard gold,OSP,ect

Min.board thickness(multilayer) 4layers:0.4mm;
6layers:0.6mm;
8layers:1.0mm;
10layers:1.20mm
Board materials

FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic,

PTFE,nelcon,

ISOLA,polyclad 370 HR); heavy copper,

Metal base clade laminate

Plating thickness (Technique:

Immersion Ni/Au)

Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''
Impedance control ± 10%

Distance between

line to board edge

Outline: 0.2mm

V-CUT: 0.4mm

Base copper thickness(Inner

and outer layer)

Min. thickness: 0.5 OZ Max.thickness: 6OZ Min.hole size(board thickness ≥2mm) Aspect ratio≤16
Finished copper thickness Outer layers:
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness :0.5OZ,
Max.thickness : 6 OZ
Max.board thickness(single&doule sided) 3.20mm

 

Advantages:


• Strict product liability, taking IPC-A-160 standard
• Engineering pretreatment before production
• Production process control (5Ms)
• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC
• 100% AOI inspection, including X-ray, 3D microscope and ICT
• High-voltage test, impedance control test
• Micro section, soldering capacity, thermal stress test, shocking test
• In-house PCB production
• No minimum order quantity and free sample
• Focus on low to medium volume production
• Quick and on-time delivery

 

 

 

 

 

8Lyaer Immersion Tin Lead Free PCB Electronic Board Assembly 1.0mm Board Thickness 0

 

FAQ :

 

1. How do ACCPCB ensure quality?

 

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

 

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

 

PCB Gerber files with RS-274-X format.


4. What’s the typical process flow for multi-layer PCB?

 

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


5. How many types of surface finish ACCPCB can do?

 

O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.


6. What are the main factors which will affect the price of PCB?

 

Material;
Surface finish;

Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;

 

7. How to you make the impedance calculation?

 

The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.

 

 

           

Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

Send your inquiry directly to us (0 / 3000)