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2.3 Oz 12 Layer FR4 TG180 High TG PCB Prototype With 4 Mil Line

2.3 Oz 12 Layer FR4 TG180 High TG PCB Prototype With 4 Mil Line

2.3 Oz 12 Layer FR4 TG180 High TG PCB Prototype With 4 Mil Line
2.3 Oz 12 Layer FR4 TG180 High TG PCB Prototype With 4 Mil Line

Product Details:

Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: P1116127

Payment & Shipping Terms:

Minimum Order Quantity: 10PCS
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 10-12days
Payment Terms: L/C / T/T / Western Union / Paypal
Supply Ability: 30,000SQ.M/Per Month
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Detailed Product Description
Material: FR4 TG180 Thickness: 2.30mm
Surface Finish: ENIG Layer: 12L
Copper Thicknes:: 2.30Z PCB Standard: IPC-A-610 D
Type: Customized PCB Min Holes Size: 4mil
Min. Line Width: 4mil Min Copper Thicness: 20um
Solder Mask Color: Green,yellow, Red, Black Etc. Application: Server Equipment
High Light:

TG180 High TG PCB Prototype

,

FR4 High TG PCB Prototype

,

2.3 Oz PCB Prototype

2.3 Oz 12 Layer FR4 TG180 High TG PCB Prototype With 4 Mil Line

 

Production description :

 

this board is 12 layer with 2.3oz copper thickness. it is used for service equipment. PCB prototype,small volum, middle and large volume are accepted. no MOQ request for new boards. for repeat order, just meet 3sq.m.

 

PCB Flow Chart.pdf

 

Key Specifications of High Voltage  PCB:

 

Production Types: hight TG Rigid PCB

Layer :

 142Layers
Base Material :  FR4 tg180
Copper Thickness :  2.3oz
Board Thickness :  1.8 mm
Min. Finish Hole Size :  8 mil  (0.10mm)
Min. Line Width :  4 mil
Min. Line Spacing :  4 mil
Surface Finishing : ENIG
Drilling hole tolerance: +/-3 mil    (  0.075mm )
Min Outline tolerance : +/-4 mil    (  0.10mm )
Working panel size :  max:1200mmX600mm (47'' X24'')
Outline profile: Punching, Routing , CNC routing + V-cut
Solder mask : LPI Solder mask, Peelable mask
Solder Mask Color : Blue, black,yellow, matte green
Certificate : UL, CQC, TS16949, ISO14000, ROHS
Silkscreen color : White
Twist and Bow :  no more than 0.75 %

 

 

 

 

 

Rigid PCB Technical Capability:

 

 Items                                      Technical Capability
Layers 1-28 layers Min. line width/space 4mil

Max.board size (single&doule

sided)

600*1200mm Min.annular ring width: vias 3mil
Surface finish

HAL lead free,gold flash

Immersion silver,Immersion gold ,Immersion Sn,

hard gold,OSP,ect

Min.board thickness(multilayer) 4layers:0.4mm;
6layers:0.6mm;
8layers:1.0mm;
10layers:1.20mm
Board materials

FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic,

PTFE,nelcon,

ISOLA,polyclad 370 HR); heavy copper,

Metal base clade laminate

Plating thickness (Technique:

Immersion Ni/Au)

Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''
Impedance control ± 10%

Distance between

line to board edge

Outline: 0.2mm

V-CUT: 0.4mm

Base copper thickness(Inner

and outer layer)

Min. thickness: 0.5 OZ Max.thickness: 6OZ Min.hole size(board thickness ≥2mm) Aspect ratio≤16
Finished copper thickness Outer layers:
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness :0.5OZ,
Max.thickness : 6 OZ
Max.board thickness(single&doule sided) 3.20mm

 

Products Application:

 

Our products are widely used in meter, medical, solar energy, mobile, communication, industrial control, power electronics,security, consum electronics, computer, automotive, aerospace, military and so on.

 

Lead Time :

   

Lead Time 2 /L 4 /L 6/ L 8/ L
Sample Order 3-5days 6-8days 10-12days 12-14days
Mass Production 7-9days 8-10days 12-15days 15-18days
 
2.3 Oz 12 Layer FR4 TG180 High TG PCB Prototype With 4 Mil Line 0
 

FAQ :

 

1. How do ACCPCB ensure quality?

 

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

 

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB production?

 

PCB Gerber files with RS-274-X format.


4. What’s the typical process flow for multi-layer PCB?

 

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


5. How many types of surface finish ACCPCB can do?

 

ACCPCB has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

 

Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

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