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6 Layer FR4 TG170 PCB Prototype With 4 Mil Line Peelable Soldermask

6 Layer FR4 TG170 PCB Prototype With 4 Mil Line Peelable Soldermask

6 Layer FR4 TG170 PCB Prototype With 4 Mil Line Peelable Soldermask
6 Layer FR4 TG170 PCB Prototype With 4 Mil Line Peelable Soldermask

Product Details:

Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: P111614

Payment & Shipping Terms:

Minimum Order Quantity: 10PCS
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 10-12days
Payment Terms: L/C / T/T / Western Union / Paypal
Supply Ability: 30,000SQ.M/Per Month
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Detailed Product Description
Material: FR4 TG170 Thickness: 1.30mm
Surface Finish: ENIG Layer: 6L
Copper Thicknes:: 10Z PCB Standard: IPC-A-610 D
Type: Customized PCB Min Holes Size: 4mil
Min. Line Width: 4mil Min Copper Thicness: 20um
Solder Mask Color: Green,yellow, Red, Black Etc. Application: Server Equipment
High Light:

TG170 PCB Prototype

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6 Layer TG170 PCB

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Peelable Soldermask TG170 PCB

6 Layer FR4 TG170 PCB Prototype With 4 Mil Line Peelable Soldermask

 

Production description :

 

this board is 6 layer with peelable soldermask. it is used for scan equipment. PCB prototype,small volum, middle and large volume are accepted. no MOQ request for new boards. for repeat order, just meet 3sq.m.

 

 

Key Specifications of High Voltage  PCB:

 

Production Types: hight TG Rigid PCB

Layer :

 6Layers
Base Material :  FR4 tg170
Copper Thickness : 1oz
Board Thickness :  1.30mm
Min. Finish Hole Size :  8 mil  (0.10mm)
Min. Line Width :  4 mil
Min. Line Spacing :  4 mil
Surface Finishing : ENIG
Drilling hole tolerance: +/-3 mil    (  0.075mm )
Min Outline tolerance : +/-4 mil    (  0.10mm )
Working panel size :  max:1200mmX600mm (47'' X24'')
Outline profile: Punching, Routing , CNC routing + V-cut
Solder mask : LPI Solder mask, Peelable mask
Solder Mask Color : Blue, black,yellow, matte green
Certificate : UL, CQC, TS16949, ISO14000, ROHS
Silkscreen color : White
Twist and Bow :  no more than 0.75 %

 

PCB Flow Chart.pdf

 

Rigid PCB Technical Capability:

 

 Items                                      Technical Capability
Layers 1-28 layers Min. line width/space 4mil

Max.board size (single&doule

sided)

600*1200mm Min.annular ring width: vias 3mil
Surface finish

HAL lead free,gold flash

Immersion silver,Immersion gold ,Immersion Sn,

hard gold,OSP,ect

Min.board thickness(multilayer) 4layers:0.4mm;
6layers:0.6mm;
8layers:1.0mm;
10layers:1.20mm
Board materials

FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic,

PTFE,nelcon,

ISOLA,polyclad 370 HR); heavy copper,

Metal base clade laminate

Plating thickness (Technique:

Immersion Ni/Au)

Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''
Impedance control ± 10%

Distance between

line to board edge

Outline: 0.2mm

V-CUT: 0.4mm

Base copper thickness(Inner

and outer layer)

Min. thickness: 0.5 OZ Max.thickness: 6OZ Min.hole size(board thickness ≥2mm) Aspect ratio≤16
Finished copper thickness Outer layers:
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness :0.5OZ,
Max.thickness : 6 OZ
Max.board thickness(single&doule sided) 3.20mm

 

Products Application:

 

Our products are widely used in meter, medical, solar energy, mobile, communication, industrial control, power electronics,security, consum electronics, computer, automotive, aerospace, military and so on.

 

 


6 Layer FR4 TG170 PCB Prototype With 4 Mil Line Peelable Soldermask 0
 

FAQ :

 

 

1. What kinds of boards can ACCPCB process?

 

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


2. What data are needed for PCB production?

 

PCB Gerber files with RS-274-X format.


3. What’s the typical process flow for multi-layer PCB?

 

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


4. How many types of surface finish ACCPCB can do?

 

ACCPCB has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

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