|Place of Origin:||China|
|Certification:||ISO, UL, SGS,TS16949|
|Minimum Order Quantity:||10PCS|
|Packaging Details:||Vacuum packing with desiccant|
|Payment Terms:||L/C / T/T / Western Union / Paypal|
|Supply Ability:||30,000SQ.M/Per Month|
|Copper Thicknes::||10Z||PCB Standard:||IPC-A-610 D|
|Type:||Customized PCB||Min Holes Size:||4mil|
|Min. Line Width:||4mil||Min Copper Thicness:||20um|
|Solder Mask Color:||Green,yellow, Red, Black Etc.||Application:||Server Equipment|
TG170 PCB Prototype,
6 Layer TG170 PCB,
Peelable Soldermask TG170 PCB
6 Layer FR4 TG170 PCB Prototype With 4 Mil Line Peelable Soldermask
Production description :
this board is 6 layer with peelable soldermask. it is used for scan equipment. PCB prototype,small volum, middle and large volume are accepted. no MOQ request for new boards. for repeat order, just meet 3sq.m.
Key Specifications of High Voltage PCB:
|Production Types:||hight TG Rigid PCB|
|Base Material :||FR4 tg170|
|Copper Thickness :||1oz|
|Board Thickness :||1.30mm|
|Min. Finish Hole Size :||8 mil (0.10mm)|
|Min. Line Width :||4 mil|
|Min. Line Spacing :||4 mil|
|Surface Finishing :||ENIG|
|Drilling hole tolerance:||+/-3 mil ( 0.075mm )|
|Min Outline tolerance :||+/-4 mil ( 0.10mm )|
|Working panel size :||max:1200mmX600mm (47'' X24'')|
|Outline profile:||Punching, Routing , CNC routing + V-cut|
|Solder mask :||LPI Solder mask, Peelable mask|
|Solder Mask Color :||Blue, black,yellow, matte green|
|Certificate :||UL, CQC, TS16949, ISO14000, ROHS|
|Silkscreen color :||White|
|Twist and Bow :||no more than 0.75 %|
Rigid PCB Technical Capability:
Our products are widely used in meter, medical, solar energy, mobile, communication, industrial control, power electronics,security, consum electronics, computer, automotive, aerospace, military and so on.
1. What kinds of boards can ACCPCB process?
Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.
2. What data are needed for PCB production?
PCB Gerber files with RS-274-X format.
3. What’s the typical process flow for multi-layer PCB?
Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.
4. How many types of surface finish ACCPCB can do?
ACCPCB has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.
Contact Person: sales