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8 Layer ITEQ Fr4 Tg180 High TG PCB With Gold Plating Surface Finishing

8 Layer ITEQ Fr4 Tg180 High TG PCB With Gold Plating Surface Finishing

8 Layer ITEQ Fr4 Tg180 High TG PCB With  Gold Plating Surface Finishing
8 Layer ITEQ Fr4 Tg180 High TG PCB With  Gold Plating Surface Finishing

Product Details:

Place of Origin: China
Brand Name: ACCPCB
Certification: ISO, UL, SGS,TS16949
Model Number: P111615

Payment & Shipping Terms:

Minimum Order Quantity: 10PCS
Price: Negotiable
Packaging Details: Vacuum packing with desiccant
Delivery Time: 10-12days
Payment Terms: L/C / T/T / Western Union / Paypal
Supply Ability: 30,000SQ.M/Per Month
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Detailed Product Description
Material: KBFR4 Tg180 Thickness: 1.60mm
Surface Finish: Gold Plating Layer: 8L
Pcb Standard: IPC-A-610 D Usage: OEM Electronics
Copper Thickness: 1oz Min. Line Spacing: 0.2mm
Min. Hole Size: 0.1mm Product Name: Printed Circuit Board
Solder Mask: Green. Red. Blue. White. Black.Yellow Type: OEM PCB,customized PCB
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8 Layer ITEQ Fr4 Tg180 High TG PCB With Gold Plating Surface Finishing

 

Production description :

 

this board is 8 layer with 1 oz copper thickness.PCB prototype,samll volum, middle and large volume are accepted. no MOQ request for new order. all of these boards are met UL,TS16949, ISO9001 Etc.

 

PCB Flow Chart.pdf

 

Key Specifications/Special Features :

 

Layer : 6 Layers
Base Material : KBFR4 tg180
Copper Thickness : 1oz in all layer
Board Thickness : 1.60mm
Min. Hole Size : 9 mil
Min. Line Width : 5 mil
Min. Line Spacing : 5 /mil
Surface Finishing : gold plating
Solder Mask Color : Green
Certificate : UL, CQC, TS16949, ISO14000, ROHS
Silkscreen color : White
Outline profile : Routing, punching
Twist and bow : 0.75%
Immpedance control : +/- 10%
Solder mask :  LPI solder mask, peelable mask

 

 

ACCPCB Technical Capability.pdf

 

Products Application:

 

1, Consumer Electronics: TV, DVD,Digital Caramer, air conditoner, Refrigerator,set-top box etc;

 

2, Security monitor: Moible phone, PDA, GPS, caramer monitor etc;

 

3, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc;

 

4, Industrial controls: Medical device ,UPS equipment, Control device etc;

 

5, Vehicle Electronices: Car etc;

 

6, Military & Defense : Military Weapons etc;

 


8 Layer ITEQ Fr4 Tg180 High TG PCB With  Gold Plating Surface Finishing 0

 
 
 
 FQA :
 

1. What’s the typical process flow for multi-layer PCB?

 

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


2. What data are needed for PCB production?

 

PCB Gerber files with RS-274-X format.

 

 

3. How do ACCPCB ensure quality?

 

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

 


4. How many types of surface finish ACCPCB  can do?

 

O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

 

 

5. What are the main factors which will affect the price of PCB?

 

Material;
Surface finish;

Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;

 

Contact Details
Accuracy Electronics Technologies Co.,Ltd

Contact Person: sales

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