Bluetooth Speaker 0.1mm 4 Mil PCB Minimum Line Spacing

Bluetooth Speaker High TG PCB Wide Applicaton 0.1mm 4 Mil Minimum Line Spacing

Key Specifications/Special Features :

Quality assurance :

• Every production process has a special person to test to ensure quality, AOI and E-testing.
• Have professional engineers to check the quality
• All products have passed CE, FCC, ROHS and other certifications

Application:

Industril Control System
Power Supply
LED drive, LED Lighting
Communication Device
automotive electronics
Security Electronics
Household Control
Digital Appliances
Frequency converter
Medical Device

Shipping Information:

FOB Port : Hong Kong / Shenzhen                                     Lead Time : 8 - 15 days
HTS Code : 8534.00.10                                    Dimensions per Carton : 37X27X22mm
Weight Per Carton : 20 Kilograms

FAQ :

1. How do ACCPCB ensure quality?

Our high quality standard is achieved with the following.

1.1 The process is strictly controlled under ISO 9001:2008 standards.
1.2 Extensive use of software in managing the production process
1.3 State-of-art testing equipments and tools. E.g. Flying Probe,e-Testing, X-ray Inspection, AOI (Automated Optical Inspector) .
1.4.Dedicated quality assurance team with failure case analysis process

2. What kinds of boards can ACCPCB process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.

3. What data are needed for PCB production?

PCB Gerber files with RS-274-X format.

4. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.

5. How many types of surface finish ACCPCB can do?

O-the leader has the full series of surface finish, such as: ENIG, OSP, LF-HASL, gold plating (soft/hard), immersion silver, Tin, silver plating, immersion tin plating, carbon ink and etc. .. OSP, ENIG, OSP + ENIG commonly used on the HDI, we usually recommend that you use a client or OSP OSP + ENIG if BGA PAD size less than 0.3 mm.

6. What are the main factors which will affect the price of PCB?

Material;
Surface finish;

Board thickness, Copper thickness;
Technology difficulty;
Different quality criteria;
PCB characteristics;
Payment terms;

7. How to you make the impedance calculation?

The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment.